Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00376493" target="_blank" >RIV/68407700:21230/24:00376493 - isvavai.cz</a>

Result on the web

<a href="https://doi.org/10.3390/ma17174242" target="_blank" >https://doi.org/10.3390/ma17174242</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/ma17174242" target="_blank" >10.3390/ma17174242</a>

Result language

angličtina

Original language name

Influence of Solder Mask on Electrochemical Migration on Printed Circuit Boards

Original language description

Electrochemical migration (ECM) on the surface of printed circuit boards (PCBs) continues to pose a significant reliability risk in electronics. Nevertheless, the existing literature lacks studies that address the solder mask and solder pad design aspects in the context of ECM. Therefore, the objective of this study was to assess the impact of solder mask type with varying roughness and solder pad design on the susceptibility to ECM using a water drop test and thermal humidity bias test. Hot air solder leveling-coated PCBs were tested. Furthermore, the ECM tests were conducted on PCBs with applied no-clean solder paste to evaluate the influence of flux residues on the resulting ECM behavior. The results indicated that the higher roughness of the solder mask significantly contributes to ECM inhibition through the creation of a mechanical barrier for the dendrites. Furthermore, lower ECM susceptibility was also observed for copper-defined pads, where a similar effect is presumed. However, the influence of the no-clean flux residues can prevail over the effects of the solder mask. Therefore, the use of a rough solder mask and a copper-defined pad design is recommended if the PCB is to be washed from flux residues after the soldering process.

Czech name

—

Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

—

OECD FORD branch

20201 - Electrical and electronic engineering

Project

—

Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2024

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Materials

ISSN

1996-1944

e-ISSN

1996-1944

Volume of the periodical

17

Issue of the periodical within the volume

17

Country of publishing house

CH - SWITZERLAND

Number of pages

19

Pages from-to

1-19

UT code for WoS article

001310950200001

EID of the result in the Scopus database

2-s2.0-85203661943