Analysis of no-clean flux spatter during the soldering process

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00332430" target="_blank" >RIV/68407700:21230/20:00332430 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1016/j.jmatprotec.2019.116289" target="_blank" >https://doi.org/10.1016/j.jmatprotec.2019.116289</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.jmatprotec.2019.116289" target="_blank" >10.1016/j.jmatprotec.2019.116289</a>

Result language
angličtina
Original language name
Analysis of no-clean flux spatter during the soldering process
Original language description
The investigation of the flux spattering in dependency on surface roughness of the substrate was conducted in order to decrease reliability issues during reflow soldering caused by insulating character of flux residues. Sample boards with matt and glossy solder mask, HASL and ENIG surface finish and two types of SAC305 lead-free solder paste with different flux chemistry (ROL1 and ROL0) were used in the experiment. The number of the flux residues, their area and the area of flux spreading around a soldering pad were evaluated by the image analysis. The dependency of the flux spattering on flux spread was found. The use of glossy solder mask instead of matt solder mask reduced the number of flux residues by approximately 50%.
Czech name
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Czech description
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Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering

Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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