All

What are you looking for?

All
Projects
Results
Organizations

Quick search

  • Projects supported by TA ČR
  • Excellent projects
  • Projects with the highest public support
  • Current projects

Smart search

  • That is how I find a specific +word
  • That is how I leave the -word out of the results
  • “That is how I can find the whole phrase”

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00353696" target="_blank" >RIV/68407700:21230/21:00353696 - isvavai.cz</a>

  • Result on the web

    <a href="https://doi.org/10.3390/ma14247909" target="_blank" >https://doi.org/10.3390/ma14247909</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.3390/ma14247909" target="_blank" >10.3390/ma14247909</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints

  • Original language description

    Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/ROL1 flux classification, glossy or matt solder mask, and OSP/HASL/ENIG soldering pad surface finish. Two original SAC305 solder pastes differing only in the used flux were chosen for the experiment. The influence of multiple reflows was also observed. The intermetallic layer thicknesses were obtained by the image analysis of micro-section images. The flux type proved to have a significant impact on the intermetallic layer thickness. The solder paste with ROL1 caused an increase in IML thickness by up to 40% in comparison to an identical paste with ROL0 flux. Furthermore, doubling the roughness of the solder mask has increased the resulting IML thickness by 37% at HASL surface finish and by an average of 22%.

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2021

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Materials

  • ISSN

    1996-1944

  • e-ISSN

    1996-1944

  • Volume of the periodical

    14

  • Issue of the periodical within the volume

    24

  • Country of publishing house

    CH - SWITZERLAND

  • Number of pages

    13

  • Pages from-to

  • UT code for WoS article

    000738344300001

  • EID of the result in the Scopus database

    2-s2.0-85121569995