SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00377313" target="_blank" >RIV/68407700:21230/24:00377313 - isvavai.cz</a>

Result on the web

<a href="https://doi.org/10.1002/adem.202401366" target="_blank" >https://doi.org/10.1002/adem.202401366</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1002/adem.202401366" target="_blank" >10.1002/adem.202401366</a>

Result language

angličtina

Original language name

SnAgCu Solder Joint Microstructure Evolution During Thermal Aging: Influence of Flux

Original language description

An intermetallic layer (IML) between the solder alloy and the soldered surface affects the mechanical and electrical performance of the resulting joints. Numerous studies have explored the possibilities of influencing the IML to achieve more reliable interconnections. However, the type and composition of the used flux, crucial for the proper creation of solder joints, is rarely included as a possible influencing factor. In this article, a comprehensive study on the interfacial microstructure evolution of lead-free SnAgCu solder joints, accounting for the flux type and the temperature of the preheating phase of reflow soldering, where the flux contained in the solder paste becomes active, is presented. In the results, it is shown that the IML of as-reflowed and thermally aged solder joints depends significantly on the flux. The IML activation energy is 57% higher for rosin-based low-activity (ROL)0 flux compared to ROL1 flux. The ROL0 flux, containing fewer active components, also outperforms the ROL1 flux in both the mechanical and electrical properties of the joints. Furthermore, the temperature profiles also show slight differences in measured properties, with the fluxes responding differently to changes in preheating temperature. In the presented results, importance of the used flux on solder joint microstructure is demonstrated.

Czech name

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Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

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OECD FORD branch

20501 - Materials engineering

Project

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Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2024

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Advanced Engineering Materials

ISSN

1438-1656

e-ISSN

1527-2648

Volume of the periodical

26

Issue of the periodical within the volume

23

Country of publishing house

DE - GERMANY

Number of pages

14

Pages from-to

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UT code for WoS article

001320133300001

EID of the result in the Scopus database

2-s2.0-85204688403