Surface finish influence on PCB contamination by flux spattering effect

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F15%3A10314669" target="_blank" >RIV/00216208:11320/15:10314669 - isvavai.cz</a>
Alternative codes found
RIV/68407700:21230/15:00233972
Result on the web
<a href="http://dx.doi.org/10.1109/ISSE.2015.7247998" target="_blank" >http://dx.doi.org/10.1109/ISSE.2015.7247998</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2015.7247998" target="_blank" >10.1109/ISSE.2015.7247998</a>

Result language
angličtina
Original language name
Surface finish influence on PCB contamination by flux spattering effect
Original language description
Mechanical stability of solder joints has influence on total reliability of electronic products. Mechanical stress affect on properties of solder joints during function, transport and storage of the electronic products. A method which is commonly used inelectronic industry to classify Flux spattering effect can appear during the manufacturing assembly process, especially during reflow process, when the solder paste, which contains flux, is heated and the flux is spattered and contaminate surroundings.This effect mostly happened due to moisture absorption by the solder paste or due to improperly temperature profile settings during the reflow process. Spattered residues of flux have a non-conductive character and therefore it caused a problem in quality testing of the product, especially when a spot of flux reside appear on the PCB testing pad than the in-circuit test marked tested product as the bad one even though that it is a good one. This article deals with influence of surface fi
Czech name
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Czech description
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Project
<a href="/en/project/LM2011025" target="_blank" >LM2011025: MLTL - Magnetism and Low Temperature Laboratories - operation and development of national research infrastructure</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology
ISBN
978-1-4799-8860-0
ISSN
2161-2528
e-ISSN
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Number of pages
4
Pages from-to
241-244
Publisher name
IEEE
Place of publication
New York, USA
Event location
Eger, Hungary
Event date
May 6, 2015
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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