Toward reducing no-clean flux spatter during reflow soldering: Investigating the effect of flux type, solder mask, and solder pad design
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00358881" target="_blank" >RIV/68407700:21230/22:00358881 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1016/j.jmapro.2022.07.027" target="_blank" >https://doi.org/10.1016/j.jmapro.2022.07.027</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.jmapro.2022.07.027" target="_blank" >10.1016/j.jmapro.2022.07.027</a>
Alternative languages
Result language
angličtina
Original language name
Toward reducing no-clean flux spatter during reflow soldering: Investigating the effect of flux type, solder mask, and solder pad design
Original language description
This comprehensive study dealt with the reliability issue of no-clean flux spattering from the solder paste during the reflow soldering process. Several factors entering the process were investigated: the type of flux in the solder paste (ROL0/ROL1 according to the IPC J-STD-004B standard), the type of solder mask (liquid photo imageable/directly printed), and the type of solder pad design (copper-defined/solder mask-defined). A unique design of the test board was developed for a proper evaluation of flux spatter spots spattered from the solder paste. The testing board included real-sized soldering pads and a boron-silicate glass slide as a target area, ensuring the same evaluation process for all samples. The results showed a strong influence of flux chemistry on spattering. Changing the flux from ROL1 to ROL0 reduced the flux spot occurrence by 62 % on average. The type of solder pad design also slightly affected the flux spattering. No significant difference was found between the used solder masks; therefore, it is possible to use the novel, directly printed one without increasing the risk of flux spattering.
Czech name
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Czech description
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Classification
Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Journal of Manufacturing Processes
ISSN
1526-6125
e-ISSN
2212-4616
Volume of the periodical
81
Issue of the periodical within the volume
9
Country of publishing house
DE - GERMANY
Number of pages
11
Pages from-to
696-706
UT code for WoS article
000890918700001
EID of the result in the Scopus database
2-s2.0-85134841276