Experimental and Numerical Analysis of Melting and Solidification of SnAgCu Joints

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00301669" target="_blank" >RIV/68407700:21230/16:00301669 - isvavai.cz</a>

Result on the web

<a href="http://dx.doi.org/10.1109/TCPMT.2016.2593709" target="_blank" >http://dx.doi.org/10.1109/TCPMT.2016.2593709</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/TCPMT.2016.2593709" target="_blank" >10.1109/TCPMT.2016.2593709</a>

Result language

angličtina

Original language name

Experimental and Numerical Analysis of Melting and Solidification of SnAgCu Joints

Original language description

One of the most vulnerable components of electronic circuits is the solder joints. The most common technique of soldering used in electronics is the reflow soldering. During the soldering process, different issues may occur leading to the inception of some defects (tombstone effect, flux spattering, etc.). To avoid these defects, it is mandatory to follow the parameter values of the reflow process, especially temperature values. In this paper, the temperature distribution for three types of samples (two interconnected soldering pads–without solder, with solder on one pad, and with solder on both pads) during the reflow soldering process, calculated with Comsol Multiphysics software (heat transfer 3-D module) is presented. The calculated values are then compared to the ones obtained by experiments in order to verify the accuracy of the numerical model. To carry out the computations, the latent heat of melting/solidification and the variation with the temperature of the solder parameters were considered. The results show that there is a good correlation between the measured and calculated values, the differences (for all types of samples) being lower than ±3 °C.

Czech name

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Czech description

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Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2016

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

IEEE Transactions on Components, Packaging and Manufacturing Technology

ISSN

2156-3950

e-ISSN

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Volume of the periodical

6

Issue of the periodical within the volume

9

Country of publishing house

US - UNITED STATES

Number of pages

11

Pages from-to

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UT code for WoS article

000384647200016

EID of the result in the Scopus database

2-s2.0-84983048364