The Quality of BGA Solder Joint with Underfill
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F16%3APU121476" target="_blank" >RIV/00216305:26220/16:PU121476 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
The Quality of BGA Solder Joint with Underfill
Original language description
This paper deals with investigation of mechanical behavior (shear strength) of soldered BGA package with and without underfill on FR4 and Al2O3 carriers. BGA soldered on FR4 (ENIG) had higher value of shear strength than BGA soldered on alumina substrate with conductive thick film layer. Results was used for validation of virtual model and simulation in ANSYS Workbench. This simulation will be used for prediction of thermomechanical behavior of BGA packages soldered on alumina substrates and on organic substrates FR4.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Sborník IMAPS flash Conference 2016
ISBN
978-80-214-5419-4
ISSN
1802-4564
e-ISSN
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Number of pages
36
Pages from-to
19-22
Publisher name
Neuveden
Place of publication
Neuveden
Event location
Brno
Event date
Nov 3, 2016
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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