Influence of heating direction on BGA solder balls structure

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F18%3APU127732" target="_blank" >RIV/00216305:26220/18:PU127732 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/8346878/" target="_blank" >https://ieeexplore.ieee.org/document/8346878/</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.23919/EMPC.2017.8346878" target="_blank" >10.23919/EMPC.2017.8346878</a>

Result language
angličtina
Original language name
Influence of heating direction on BGA solder balls structure
Original language description
The soldering of BGA packages is well known process. Despite the increasing complexity of PCBs and diversity of BGA package footprints, further optimization and improvement of soldering is required. In this paper, the influence of heat flow direction during reflow soldering on the structure of ball joint was described. The SAC305 solder alloy was used for ball joint investigation under the no-clean solder flux condition. Tested samples were made from FR4 material with ENIG as a surface finish. The heating was generated by infrared heaters placed on the top, bottom and both sides of the sample. The substantial part of this work was focused on the characterization the solder joint structure with the respect to the intermetallic compounds formation. SEM and optical microscope images of cross-sectioned solder joints were used to characterize the quality of the boundary formation. Shear test method was used to evaluate the impact of intermetallic layer and inner solder joint structure on the mechanical properties of joints. This research helps to determine the influence of the direction of heat flux, i.e. direction of heating of the infrared heater used in the reflow soldering, for the formation of the solder ball joint on BGA package (primarily for rework).
Czech name
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Czech description
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Publication year
2018
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European
ISBN
978-0-9568086-4-6
ISSN
—
e-ISSN
—
Number of pages
4
Pages from-to
1-4
Publisher name
Neuveden
Place of publication
Neuveden
Event location
Warsaw, Polsko
Event date
Sep 10, 2017
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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