A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00378837" target="_blank" >RIV/68407700:21230/24:00378837 - isvavai.cz</a>

Result on the web

<a href="https://doi.org/10.3390/ma17112693" target="_blank" >https://doi.org/10.3390/ma17112693</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/ma17112693" target="_blank" >10.3390/ma17112693</a>

Result language

angličtina

Original language name

A Novel Approach for Temperature-Induced Ball Grid Array Collapse Observation

Original language description

This study presents a new approach to investigating the impact of repeated reflow on the failure of ball grid array (BGA) packages. The issue with the BGA package collapse is that the repeated reflow can lead to short circuits, particularly for BGAs with a very fine pitch between leads. A novel approach was developed to measure the collapse of BGA solder balls during the melting and solidification process, enabling in situ measurements. The study focused on two types of solders: Sn63Pb37 as a reference, and the commonly used SAC305, with measurements taken at various temperatures. The BGA samples were subjected to three different heating/cooling cycles in a thermomechanical analyzer (TMA) at temperatures of 250 degrees C, 280 degrees C, and 300 degrees C, with a subsequent cooling down to 100 degrees C. The results obtained from the TMA indicated differences in the collapse behavior of both BGA solder alloys at various temperatures. Short circuits between neighboring leads (later confirmed by an X-ray analysis) were also recognizable on the TMA. The novel approach was successfully developed and applied, yielding clear insights into the behavior of solder balls during repeated reflow.

Czech name

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Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

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OECD FORD branch

20201 - Electrical and electronic engineering

Project

—

Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2024

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Materials

ISSN

1996-1944

e-ISSN

1996-1944

Volume of the periodical

17

Issue of the periodical within the volume

11

Country of publishing house

CH - SWITZERLAND

Number of pages

10

Pages from-to

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UT code for WoS article

001246677300001

EID of the result in the Scopus database

2-s2.0-85195872261