Experimental Study of the Influence of the Temperature Profile on the BGA Soldering
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F16%3A10328838" target="_blank" >RIV/00216208:11320/16:10328838 - isvavai.cz</a>
Alternative codes found
RIV/68407700:21230/16:00303323
Result on the web
<a href="http://dx.doi.org/10.1109/ISSE.2016.7563190" target="_blank" >http://dx.doi.org/10.1109/ISSE.2016.7563190</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2016.7563190" target="_blank" >10.1109/ISSE.2016.7563190</a>
Alternative languages
Result language
angličtina
Original language name
Experimental Study of the Influence of the Temperature Profile on the BGA Soldering
Original language description
One of the most favour components, which are mounted on the printed circuit board (PCB), is Ball Grid Array (BGA) due to higher integration. On the other hand BGAs are components which are the most problematic from point of solder interconnection reliability. The aim of this work was to make experimental study of the influence of the temperature profile on the BGA soldering during its reworks on electronic equipments from point of observing the distance between the PCB and BGA package. Five temperature profiles were used with following maximum temperature in peak 239 degrees C, 246 degrees C, 253 degrees C, 255 degrees C and 259 degrees C. X-ray diagnostic of the distances between the BGA package and PCB were used with the inspection angle 45 degrees. Three BGAs were soldered and inspected for each temperature profile. The issues were found only in case when was used the temperature profile with highest maximum temperature.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/LM2011025" target="_blank" >LM2011025: MLTL - Magnetism and Low Temperature Laboratories - operation and development of national research infrastructure</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2016 39TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE)
ISBN
978-1-5090-1389-0
ISSN
2161-2536
e-ISSN
—
Number of pages
4
Pages from-to
210-213
Publisher name
IEEE
Place of publication
NEW YORK
Event location
Pilsen
Event date
May 18, 2016
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000387089800041