How to rework underfilled BGA

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00303262" target="_blank" >RIV/68407700:21230/16:00303262 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
How to rework underfilled BGA
Original language description
A Ball Grid Array (BGA) component has become one of the most popular packaging alternatives for high density integrated electronics devices. BGA packages become smaller and electrical equipment has become lighter, therefore such equipment is more sensitive to mechanical stress. Therefore the underfill of the chips is used to improve the lifetime and reliability of electronic equipment. On the other hand there are issues with removing of the underfilled component from the printed circuit board (PCB) without damaging the PCB together with soldering pads. The goal of this article is to present the rework possibility of underfilled components, when a very fine milling machine was developed for the components rework purposes in LVR at CTU in Prague.
Czech name
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Czech description
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Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Project
<a href="/en/project/LO1505" target="_blank" >LO1505: Support of Sustainability for the Development and Implementation Laboratories of the Czech Technical University in Prague</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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