Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F21%3APU141651" target="_blank" >RIV/00216305:26220/21:PU141651 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/9467519" target="_blank" >https://ieeexplore.ieee.org/document/9467519</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467519" target="_blank" >10.1109/ISSE51996.2021.9467519</a>

Result language
angličtina
Original language name
Evaluation of Influence of Flux Residues After Rework and Repair Process of Underfilled BGA Packages
Original language description
This paper is focused on evaluation of influence of flux residues encapsulated under underfill of BGA package on failure, area size and circularity of solder balls interconnection after rework and repair process. The main goal of the work was to find out whether there will be a larger number of failures for washed or unwashed underfilled BGA packages after second reflow soldering process. Repeated cycle of reflow soldering simulated rework and repair process heat stress for neighboring devices with underfill. Results of this investigation were number of failures and failure modes of solder joints of BGA package.
Czech name
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Czech description
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Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2021 44th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-6654-1477-7
ISSN
2161-2536
e-ISSN
—
Number of pages
4
Pages from-to
1-4
Publisher name
IEEE
Place of publication
neuveden
Event location
Bautzen
Event date
May 5, 2021
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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