INVESTIGATION OF INFLUENCE NITROGEN ATMOSPHERE ON THE SPREADABILITY AND RELIABILITY OF SOLDER JOINTS

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F17%3APU123487" target="_blank" >RIV/00216305:26220/17:PU123487 - isvavai.cz</a>
Result on the web
<a href="http://eeict.feec.vutbr.cz/?page_id=198" target="_blank" >http://eeict.feec.vutbr.cz/?page_id=198</a>
DOI - Digital Object Identifier
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Result language
angličtina
Original language name
INVESTIGATION OF INFLUENCE NITROGEN ATMOSPHERE ON THE SPREADABILITY AND RELIABILITY OF SOLDER JOINTS
Original language description
This article examines the impact of nitrogen atmosphere on the quality of the solder joint. For tests were used two lead-free solder pastes, specifically SAC305 and SN100C. These pastes were printed on a substrate FR4 with ENIG finish with semiautomatic devices. For reflow of paste was used specially modified desiccator. This device has hot plate with the cooling system. This system is active after reflow. In this device, it was possible to create around the solder paste a nitrogen atmosphere having defined content of residual oxygen. This experiment determined the most appropriate concentration of the protective gas atmosphere to obtain the greatest wettability and spreadability of paste, which is a prerequisite for a good solder joint.
Czech name
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Czech description
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Publication year
2017
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the 23nd Conference STUDENT EEICT 2017
ISBN
978-80-214-5496-5
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
547-551
Publisher name
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních
Place of publication
Brno
Event location
Brno
Event date
Apr 27, 2017
Type of event by nationality
CST - Celostátní akce
UT code for WoS article
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