Effect of nitrogen atmosphere on the quality of lead-free solder joints

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F12%3APU101080" target="_blank" >RIV/00216305:26220/12:PU101080 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Effect of nitrogen atmosphere on the quality of lead-free solder joints
Original language description
Reflow process is an important part of the microelectronics manufacturing. Still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering into new areas. There is a space for new material compositions which do not contain lead, new procedure process, device setting, and began to make greater use of protective atmosphere. This article is focus on nitrogen protective atmosphere. Soldering was made on alumina substrate with conductive motive created by silver paste without surface finish. Solder paste SAC305, Sn100C, SnAgCuBiIn was used and paste SnPbAg as reference. A measurement of wetting and visual inspection according IPC-610 was used to evaluate the influence of nitrogen atmosphere. Comparison between alumina and FR-4 with NiAu surface finish is shown at the end of paper.
Czech name
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Czech description
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Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
EDS 12 IMAPS CS INTERNATIONAL CONFERENCE PROCEEDINGS
ISBN
978-80-214-4539-0
ISSN
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e-ISSN
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Number of pages
6
Pages from-to
308-313
Publisher name
Ing. Vladislav Pokorný - LITERA, Tábor 43a, 612 00 Brno
Place of publication
Brno
Event location
Brno
Event date
Jun 28, 2012
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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