Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F12%3APU98701" target="_blank" >RIV/00216305:26220/12:PU98701 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6273139" target="_blank" >http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6273139</a>
DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders
Original language description
An important part of the microelectronics manufacturing is the reflow process. Even though that the soldering have a long history, the process is still not completely described. Particular still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering received into new areas. There is a space for new material compositions which do not contain lead. Furthermore, a new procedure process, adjusting of equipment and began to make greater use of nitrogen as protective gas. The aim is to compare the already proven commercial solder alloys on different carrier and evaluate more exactly the benefits of nitrogen atmosphere. The evaluation was performed for solder SAC, Sn100C and SnPb solder paste wasused as reference. Type of substrates was printed circuit board FR-4 and ceramic substrate. Soldering conducted in atmosphere with different residual oxygen. Results of this paper may serve to increase the quality of soldering classical
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
35th International Spring Seminar on Electronics Technology - ISSE 2012 Proceedings
ISBN
978-1-4673-2241-6
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
201-206
Publisher name
Vienna University of Technology
Place of publication
Gusshausstrasse 27- 29, A-1040 WIEN - Austria: I
Event location
Bad Aussee
Event date
May 9, 2012
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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