MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F13%3A00210400" target="_blank" >RIV/68407700:21230/13:00210400 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
MEASUREMENT OF SOLDER ALLOYS SOLDERABILITY ON COPPER SAMPLES WITH DIFFERENT THERMAL CAPACITY
Original language description
Solderability is an essential characteristic of soldering system in electronics industry. Molten solder must show good solderability, on the substrate surface to ensure a good quality of solder joints. Solderability degree depends on many factors such astype of solder alloy together with type of flux and material substrate, type of atmosphere (ambient, inert ? nitrogen), temperature of solder alloy etc. In our article we focus on dependence of solder alloys solderability on different thermal capacity.For measurement we used a wetting balance method. Wetting balance method is able to assess qualitatively the wetting of liquids (molten solders) on various substrates. Method measures wetting force during the test specimen is immersed into the liquid (into the molten solder bath). Material base of our experiments was carried on three types of solder alloys (Sn99Cu1, Sn95.5Ag3Cu0.7 and Sn63Pb37), three different thermal capacities of the samples. Different thermal capacity of the samples
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings - Electronic Devices and Systems - EDS '13
ISBN
9788021447547
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
146-149
Publisher name
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Place of publication
Brno
Event location
Brno
Event date
Jun 26, 2013
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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