Wetting Balance Measurement of Solders and Evaluation of Strong Influences on the Shape of the Wetting Curves

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F20%3A00346308" target="_blank" >RIV/68407700:21230/20:00346308 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE49702.2020.9121115" target="_blank" >https://doi.org/10.1109/ISSE49702.2020.9121115</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE49702.2020.9121115" target="_blank" >10.1109/ISSE49702.2020.9121115</a>

Result language
angličtina
Original language name
Wetting Balance Measurement of Solders and Evaluation of Strong Influences on the Shape of the Wetting Curves
Original language description
The aim of this article is comparing three types of solders (one lead: Sn63Pb37 and two lead-free: Sn95,5Ag3,8Cu0,7 and Sn97Cu3), four types of fluxes and two types of samples (copper and aluminium wire) with different thermal capacity (diameter 1 mm and 2.2 mm). The wetting curve was evaluated from the point of zero-cross time and maximal wetting force. The results show that the best results from the overall point of view were achieved for Sn63Pb37 and the worst for Sn97Cu3 solder alloy. The most substantial influence on the wetting force has the material of substrate and type of flux
Czech name
—
Czech description
—

Project
—
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2020
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2020 43rd International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-7281-6773-2
ISSN
2161-2536
e-ISSN
2161-2528
Number of pages
6
Pages from-to
—
Publisher name
IEEE Press
Place of publication
New York
Event location
Demanovska Valley
Event date
May 14, 2020
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000610543500068

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