Influence of the Reduced Oxygen Concentration on the Wetting Force
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F06%3A00167866" target="_blank" >RIV/68407700:21230/06:00167866 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Influence of the Reduced Oxygen Concentration on the Wetting Force
Original language description
This work is focused on investigation of influence of oxygen concentration on wetting force of tin-lead (Sn63Pb37) and lead-free solders (Sn95,5Ag3,8Cu0,7). Concentration of oxygen is reduced with addition of nitrogen up to concentration 1000 ppm. Wetting force is measured with equipment Meniscograph - solderability tester Mk 6 and digital oscilloscope Agilent.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2006
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
29th International Spring Seminar on Electronics Technology
ISBN
978-1-4244-0550-3
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
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Publisher name
IEEE
Place of publication
New York
Event location
St. Marienthal
Event date
May 10, 2006
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000246825800013