Wetting balance test - Comparison of solder alloys wetting

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F17%3A00316061" target="_blank" >RIV/68407700:21230/17:00316061 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/document/8000923/" target="_blank" >http://ieeexplore.ieee.org/document/8000923/</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2017.8000923" target="_blank" >10.1109/ISSE.2017.8000923</a>

Result language
angličtina
Original language name
Wetting balance test - Comparison of solder alloys wetting
Original language description
The article deals with wetting balance method comparison of solderability of the following materials combinations: two lead free solder alloys (Sn99Cu1, Sn95.5Ag3.8Cu0.7), one leaded solder alloy (Sn63Pb37), one soldering substrate type - copper wire (0.7 mm diameter) and four type of fluxes. The surface of tested samples was additionally evaluated by subjective optical analysis. The results confirm that the best results were achieved for Sn63Pb37 solder alloy - it has the fastest wetting speed (lowest zero cross time). Out of the lead free solder alloys, better results were achieved with Sn95.5Ag3.8Cu0.7 solder.
Czech name
—
Czech description
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Project
—
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2017
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
40th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-5386-0582-0
ISSN
2161-2536
e-ISSN
—
Number of pages
4
Pages from-to
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Publisher name
IEEE
Place of publication
New York
Event location
Sofia
Event date
May 10, 2017
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000426973000046

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