Effect of reflow technology and surface finishes of PCB on solder spreading
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F13%3A10190702" target="_blank" >RIV/00216208:11320/13:10190702 - isvavai.cz</a>
Alternative codes found
RIV/68407700:21230/13:00210827
Result on the web
<a href="http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=06648230" target="_blank" >http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=06648230</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2013.6648230" target="_blank" >10.1109/ISSE.2013.6648230</a>
Alternative languages
Result language
angličtina
Original language name
Effect of reflow technology and surface finishes of PCB on solder spreading
Original language description
A key process in surface mount technology is soldering, when a metallurgical joint is formed between the molten solder and metal surfaces. Solders in molten state have to show good spreading action together with good wetting of substrate. Molten solder flows or spreads on the metal surface to ensure good future formation of solder joint. Monitoring of solder spreading is one of the tools which can be used to solderability and wettability quantification. Measurement of spreading of molten solders is oneof the tools that can be used to estimation of their wettability and solderability. Each solder has a different degree of spreading on the metal surface. Degree of spreading mainly depends on combination of flux, solder alloy, soldered substrate. This study is focused to investigate effect of reflow technology and PCBs surface finishes on spreading of molten solders. In our experiment we used four types of surface finishes (lead free HASL., passivated cooper, ENIG and immersion Sn), five
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
BM - Solid-state physics and magnetism
OECD FORD branch
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Result continuities
Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology
ISBN
978-1-4799-0036-7
ISSN
2161-2528
e-ISSN
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Number of pages
4
Pages from-to
136-139
Publisher name
IEEE
Place of publication
Rumunsko
Event location
Alba Iulia; Romania
Event date
May 8, 2013
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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