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Component Displacement and Solder Spreadability Dependence on Manufacturing Conditions

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F18%3A00326094" target="_blank" >RIV/68407700:21230/18:00326094 - isvavai.cz</a>

  • Result on the web

    <a href="https://ieeexplore.ieee.org/document/8443697/keywords#keywords" target="_blank" >https://ieeexplore.ieee.org/document/8443697/keywords#keywords</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/ISSE.2018.8443697" target="_blank" >10.1109/ISSE.2018.8443697</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Component Displacement and Solder Spreadability Dependence on Manufacturing Conditions

  • Original language description

    This paper aims at an examination of the influence of various kinds of surface finishing of printed circuit board metallizations, two different lead-free solders and one lead-containing solder as reference, and two methods of soldering on the spreading behavior. The parameters examined were the solder geometry as a measure for spreading and the displacement of surface mount components. Series of samples were examined using the 3D microscope HAWK QC 5000 and Nikon Instruments Software for Basic Research. This work is intended to facilitate the selection of suitable material combinations to achieve an optimum solder joint quality. Keywords: lead-free soldering, solder wettability, factor analyses

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

  • Continuities

    I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2018

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    2018 41st International Spring Seminar on Electronics Technology (ISSE)

  • ISBN

    978-3-319-73847-5

  • ISSN

    2161-2536

  • e-ISSN

  • Number of pages

    5

  • Pages from-to

  • Publisher name

    IEEE

  • Place of publication

    NEW YORK, NY

  • Event location

    Zlatibor, Serbia

  • Event date

    May 16, 2018

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000449866600071