Influence of Different Surface Finishes of PCB on the Solder Spread
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F11%3A10109244" target="_blank" >RIV/00216208:11320/11:10109244 - isvavai.cz</a>
Alternative codes found
RIV/68407700:21230/11:00185875
Result on the web
<a href="http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053576" target="_blank" >http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6053576</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2011.6053576" target="_blank" >10.1109/ISSE.2011.6053576</a>
Alternative languages
Result language
angličtina
Original language name
Influence of Different Surface Finishes of PCB on the Solder Spread
Original language description
Monitoring of the solder spread is one of the tools which should be used to solderability and wetability quantification. In this paper we focus on the different solder spread in correlation with different surface finishes of the PCB and different type ofreflow process. In our experiment we used three types of solder pastes (one lead Sn62Pb32Ag2 and two lead free Sn95,5Ag4Cu0,5, Sn99,25Cu0,7Ni0,05 solders) and four types of surface finishes of PCB (lead free H.A.L., pasivated cooper, immersion tin plating, chemical gold plating) and we used two types of reflow processes - vapor phase reflow process and continuous hot air reflow process. Solders spreading area was evaluated by image analysis.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
BM - Solid-state physics and magnetism
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
IEEE X plore PROCEEDINGS
ISBN
978-1-4577-2111-3
ISSN
2161-2528
e-ISSN
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Number of pages
4
Pages from-to
192-195
Publisher name
Československá sekce IEEE (The Institute of Electrical and Electronics Engineers)
Place of publication
US
Event location
Tatranská Lomnice, Slovensko
Event date
May 11, 2011
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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