Image Analysis of Solder Spread Factor on Different Material Types

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F09%3A00159312" target="_blank" >RIV/68407700:21230/09:00159312 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Image Analysis of Solder Spread Factor on Different Material Types

Original language description

The spread factor of the solders is one of the tools which should be used to solderability and wetability quantification. Two types of solders (Sn62Pb36Ag2, Sn95,5Ag4Cu0,5) four types of material (lead free H.A.L., passivated copper, immersion tin plating, chemical gold plating) ware used in experiment. The differences between the solder spread factor on the different types of material ware evaluated by image analysis of the spread factor surface.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2009

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

32nd ISSE 2009 Proceedings

ISBN

978-1-4244-4260-7

ISSN

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e-ISSN

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Number of pages

4

Pages from-to

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Publisher name

VUT v Brně, FEI

Place of publication

Brno

Event location

Brno

Event date

May 13, 2009

Type of event by nationality

EUR - Evropská akce

UT code for WoS article

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