Bismuth-based Solder Alloys: Influence of Added Phosphorus and Gallium on Wettability and Spreading

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00358701" target="_blank" >RIV/68407700:21230/22:00358701 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE54558.2022.9812828" target="_blank" >https://doi.org/10.1109/ISSE54558.2022.9812828</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE54558.2022.9812828" target="_blank" >10.1109/ISSE54558.2022.9812828</a>

Result language
angličtina
Original language name
Bismuth-based Solder Alloys: Influence of Added Phosphorus and Gallium on Wettability and Spreading
Original language description
Due to the restrictions on lead solder alloy, there is an ongoing search for alternative lead-free alloys with the best possible solder properties similar to Pb-based solder alloys. Therefore, phosphorus and gallium are, for example, added to solder alloys, which could lead to an improvement in their solder properties (wettability, mechanical, lower melting point). These additives are usually used for the improvement of SAC alloys. This work focused on lead-free low-temperature solders based on tin and bismuth. The effect of added 1 wt.% gallium and traces of phosphorus on wettability and spreading was studied. These properties were observed on FR4 boards with three different surface materials: copper, copper with hot air solder leveling surface finish (HASL) and copper with electroless nickel-immersion gold surface finish (ENIG). Examined alloys were Bi58Sn42, Bi58Sn42P, Bi59Sn40Ga1 and Bi59Sn40Ga1P. The results showed that although the addition of Ga and P exhibited no significant improvement or even decrease in the wetting and spreading ability of the solder alloy on copper and ENIG surfaces, the wetting behavior of the doped alloys was better on HASL surface compared to the eutectic solder alloy.
Czech name
—
Czech description
—

Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2022 45th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-6654-6589-2
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
5
Pages from-to
—
Publisher name
IEEE Press
Place of publication
New York
Event location
Vienna
Event date
May 11, 2022
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000853642200067

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