Influence of Added Phosphorus and Gallium in Lead-free Bismuth-Tin Alloys on Wetting and Intermetallic Compounds

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00350916" target="_blank" >RIV/68407700:21230/21:00350916 - isvavai.cz</a>

Result on the web

<a href="https://doi.org/10.1109/ISSE51996.2021.9467660" target="_blank" >https://doi.org/10.1109/ISSE51996.2021.9467660</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467660" target="_blank" >10.1109/ISSE51996.2021.9467660</a>

Result language

angličtina

Original language name

Influence of Added Phosphorus and Gallium in Lead-free Bismuth-Tin Alloys on Wetting and Intermetallic Compounds

Original language description

The aim of this work is to evaluate a wettability improvement and microstructure changes by addition of gallium and trace elements of phosphorus to novel low-temperature lead-free Bi-Sn solder alloys. Four different alloys Bi59Sn40Ga1, Bi57Sn40Ga3, Bi60Sn40 and the eutectic alloy Bi58Sn42 were chosen. Furthermore, all these solders were investigated with an added small amount of phosphorus as well. For the wettability comparison, the wetting balance test in combination with three different fluxes was used. Moreover, these alloys were soldered to a copper plated test board and aged in a climatic chamber at the temperature of 80 °C for 24 days. Subsequently, metallographic cross-sections were made and analyzed by scanning electron microscope (SEM) and energy dispersive X-ray analysis (EDX). The results of the wettability analysis showed the dominance of the chosen flux while soldering. However, it is still possible to draw the conclusion that phosphorus as an additive in Bi-Sn-Ga alloys supports the wetting, which is a crucial property of the solders. On the other hand, by the addition of gallium to the Bi60Sn40, the wetting force decreased. Regarding the microstructure, two different intermetallic compounds were identified. Namely, Cu6Sn5 at the interface between Cu board and alloys Bi60Sn40P and the eutectic one Bi58Sn42. The second detected IMC was CuGa2 between Cu and solder alloys with one and three weight percent of added gallium.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

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OECD FORD branch

20201 - Electrical and electronic engineering

Project

—

Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2021

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

2021 44th International Spring Seminar on Electronics Technology (ISSE)

ISBN

978-1-6654-1477-7

ISSN

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e-ISSN

2161-2528

Number of pages

6

Pages from-to

1-6

Publisher name

IEEE Press

Place of publication

New York

Event location

Bautzen

Event date

May 5, 2021

Type of event by nationality

WRD - Celosvětová akce

UT code for WoS article

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