Study of influence of thermal capacity and flux activity on the solderability
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F14%3A00221827" target="_blank" >RIV/68407700:21230/14:00221827 - isvavai.cz</a>
Alternative codes found
RIV/00216208:11320/14:10290750
Result on the web
<a href="http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6887589&isnumber=6887550" target="_blank" >http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=6887589&isnumber=6887550</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2014.6887589" target="_blank" >10.1109/ISSE.2014.6887589</a>
Alternative languages
Result language
angličtina
Original language name
Study of influence of thermal capacity and flux activity on the solderability
Original language description
During the surface mount technological process the assembled PCB is exposed to heat when molten solder alloy wets the surfaces and creates future solder joints. The PCB with all components should ideally be exposed to the same temperature profile duringthe soldering process. The temperatures differ throughout the PCB due to different thermal capacities of used materials and components even though the temperature profile is stable. The aim of the study was to assess the solderability of the copper material with different thermal capacity and to consider the effect of different types of fluxes. The measurement was done by wetting balance method, where the wetting force is measured as a function of time during which the test specimen is immersed into, remains immersed and then it is pulled out from the solder bath. In our experiments we used copper wire of four different diameters (0.7 mm, 1 mm, 1.5 mm), three types of solders - one lead (Sn63Pb37) and two lead free (Sn99Cu1, Sn97Cu3) so
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/LM2011025" target="_blank" >LM2011025: MLTL - Magnetism and Low Temperature Laboratories - operation and development of national research infrastructure</a><br>
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2014
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
37th Int. Spring Seminar on Electronics Technology
ISBN
978-1-4799-4455-2
ISSN
—
e-ISSN
—
Number of pages
4
Pages from-to
185-188
Publisher name
IEEE
Place of publication
New York
Event location
Drážďany
Event date
May 7, 2014
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000346580500037