Influence of special cleaning compounds on PCBs solderability

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F08%3A00500518" target="_blank" >RIV/49777513:23220/08:00500518 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Influence of special cleaning compounds on PCBs solderability

Original language description

Paper deals with results of solderability testing of Printed Circuit Boards (PCBs). Several types of cleaning substances were used for PCB cleaning. Isopropylalcohol and special cleaning liquids were applied on PCBs before solderability testing. Most often used lead-free surface finishes were tested. (galvanic tin, immersion tin,electro less nickel immersion gold, organic solderability preservative and pure copper). Two methods of solderability evaluation were used for solderability assessment(wetting balance test (WBT) and area of spread (AOS) method). Paper will present solderability results after different cleaning substances application. We can see solderability improvement, represented by lower contact angles and higher wetting forces. Except these results, paper will also present the comparison of two different methods of solderability testing.

Czech name

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Czech description

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Type

D - Article in proceedings

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

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Project

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Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2008

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

ESTC 2008

ISBN

978-1-4244-2813-7

ISSN

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e-ISSN

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Number of pages

4

Pages from-to

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Publisher name

IEEE

Place of publication

Piscataway

Event location

Greenwich

Event date

Jan 1, 2008

Type of event by nationality

WRD - Celosvětová akce

UT code for WoS article

000261094400025