MECHANICAL BEHAVIOR OF SMD SOLDER JOINT SOLDERED UNDER NITROGEN ATMOSPHERE

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F15%3APU117122" target="_blank" >RIV/00216305:26220/15:PU117122 - isvavai.cz</a>
Result on the web
—
DOI - Digital Object Identifier
—

Result language
angličtina
Original language name
MECHANICAL BEHAVIOR OF SMD SOLDER JOINT SOLDERED UNDER NITROGEN ATMOSPHERE
Original language description
Solderability depends on many variable factors. The main factors here are the surface finish of PCB and component terminals, the type of flux and solder alloy, the temperature profile and the surrounding atmosphere during the soldering process. This article focuses on the study of the influence of ambient and atmosphere during the soldering process. It is known that one of the main reasons of poor solderability is the presence of oxygen. Reduced oxygen concentration can increase wetability of melted solder [1], activity of the flux, etc., which results the improvement of the reliability [2], [3]. Nitrogen is common used for establishing of inert atmosphere in the soldering process. Mechanical behavior of solder joint is also changed. Paper [4] describebetter mechanical parameters achieved by soldering in inert atmosphere, for example higher shear forces of SMDs. The main aim of this work was investigation of mechanical properties of solder joint soldered under nitrogen atmosphere.
Czech name
—
Czech description
—

Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Similar results(10)