Some Aspects of Lead Free Soldering
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F03%3APU38869" target="_blank" >RIV/00216305:26220/03:PU38869 - isvavai.cz</a>
Result on the web
—
DOI - Digital Object Identifier
—
Alternative languages
Result language
angličtina
Original language name
Some Aspects of Lead Free Soldering
Original language description
Lead free soldering implementation process needs some knowledge about materials and process compatibility. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation and final reliability. In this paper are discused factors as flux, nitrogen atmosphere et., which influencing it.
Czech name
—
Czech description
—
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
—
Result continuities
Project
—
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2003
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
ISSE 2003 Conference Proceedings
ISBN
0-7803-8002-9
ISSN
—
e-ISSN
—
Number of pages
8
Pages from-to
175-182
Publisher name
ETC Grafo Brix
Place of publication
High Tatras, Slovak Republic
Event location
High Tatras Slovak Republic
Event date
May 8, 2003
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
—