Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F04%3APU45763" target="_blank" >RIV/00216305:26220/04:PU45763 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Wetting characteristics Study of Soldering Process in Nitrogen and Nitrogen / Hydrogen Atmosphere
Original language description
Lead free soldering implementation process needs some knowledges about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settinggs. Nitrogen, nitrogen/hydrogen atmospheres have to improve solder process yield effect. These experiments are focused on wetting phenomena and describes/analyses wettability and spreadability of surfaces with different chemistry in soldering processes.Two method were used:
Czech name
Studium smáčecích charakteristik v pájecím procesu v dusíkové, dusíko-vodíkové atmosféře a porovnání se vzduchem
Czech description
Implementace procesu bezolovnatého pájení vyžaduje znalosti o materiálové a procesní kompatibilitě jednotlivých složek v procesu. Materiálová kompatibilita zahrnuje volbu povrchové úpravy, tavidla i pájky. Procesní - zahrnuje režim přetavení. Pro sledování kompatibility byly voleny i rozdílné řízené atmosféry a porovnávány se vzduchem.
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2004
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
3rd European Microelectronics and Packaging Symposium
ISBN
80-239-2835-X
ISSN
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e-ISSN
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Number of pages
7
Pages from-to
589-595
Publisher name
MPO
Place of publication
Praha
Event location
Praha
Event date
Jun 16, 2004
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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