Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F03%3APU39078" target="_blank" >RIV/00216305:26220/03:PU39078 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Wetting Characteristics Study of Soldering Process in Nitrogen and Nitrogen/Hydrogen Atmosphere
Original language description
Lead free soldering implementation process needs some knowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joint reliability. Material compatibility includes selection type of fluxes, soldering atmosphere, solder alloy composition, surface treatments of components and PCBs and optimized soldering process settingss. Since 2006 lead solder will be substituted by lead-free. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE - Waste Electrical and Electronic Equipment). Inert/inert-reduction atmosphere have to improve solder process yield effect. This short article is focused on very important part of soldering process - wetting phenomena
Czech name
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Czech description
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Publication year
2003
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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