Solder Wetting of Substrate Surface in Lead Free Soldering
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F04%3APU45759" target="_blank" >RIV/00216305:26220/04:PU45759 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Solder Wetting of Substrate Surface in Lead Free Soldering
Original language description
Soldering process containing lead will be substituted by lead-free since 2006. It is provided by ecological norms (ECO) and other related norms (i.e. WEEE ? Waste Electrical and Electronic Equipment). Lead free soldering implementation process needs someknowledge about materials and process compatibility in different industrial conditions. Material selection for soldering process has to be compatible for having the best results in wetting characteristics, solder joint formation, and final solder joointreliability. Solder wetting is the first phase in physical/chemical influencing of melted solder atoms on connected material surface. Interatomic forces start to work during wetting and these structures rise on all interaface boundary. During wetting process two free surfaces ? melted solder and solid metal transform into one interface boundary area This short article is focused on very important part of soldering process ? wetting phenomena especially wetting angle and wetting angle hy
Czech name
Bezolovnaté pájení a smáčení povrchu substrátu pájkou
Czech description
Bezolovnatý pájecí proces nahradí stávající v průběhu roku 2006. Je to dáno ekologickými normami. Proces bezolovnatého pájení vyžaduje znalosti o materiálové i procesní kompatibilitě. Volba materiálu je důležitá pro formování pájeného spoje i pro jeho spolehlivost.
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2004
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
The 11th Electronic Devices and Systems Conference
ISBN
80-214-2701-9
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
394-398
Publisher name
VUT v Brně
Place of publication
Brno
Event location
Brno
Event date
Sep 9, 2004
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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