The Influence of Nitrogen Atmosphere on Properties and Development of IMCs in Selected Lead-Free Solders
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F24%3A43972993" target="_blank" >RIV/49777513:23220/24:43972993 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/10693921" target="_blank" >https://ieeexplore.ieee.org/document/10693921</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/Diagnostika61830.2024.10693921" target="_blank" >10.1109/Diagnostika61830.2024.10693921</a>
Alternative languages
Result language
angličtina
Original language name
The Influence of Nitrogen Atmosphere on Properties and Development of IMCs in Selected Lead-Free Solders
Original language description
This study investigates the impact of different atmospheric conditions and plasma treatment on the wetting properties and intermetallic compound (IMC) thickness in lead-free soldering processes. Lead-free solders, primarily composed of high tin content, exhibit different wetting characteristics compared to traditional lead-based solders, influencing the quality and durability of solder joints. The use of an inert nitrogen atmosphere during soldering significantly improved wetting quality, reducing oxidation and enhancing solder flow. Plasma treatment further increased the wetted surface area by an average of 10%. The analysis also highlighted that thermal profiles had a more substantial effect on wetting quality and IMC properties than atmospheric conditions. Under nitrogen, IMC thickness remained stable across thermal profiles, while vacuum conditions showed increased IMC thickness and variability with high profile settings. These findings suggest that optimizing atmospheric conditions and thermal profiles is crucial for improving solder joint reliability in lead-free soldering, with plasma treatment showing potential as an additional enhancement technique. Future research will explore varying plasma treatment settings to further optimize solder joint quality.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2024
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2024 International Conference on Diagnostics in Electrical Engineering (Diagnostika) : /conference proceedings/
ISBN
979-8-3503-6149-0
ISSN
2464-7071
e-ISSN
2464-708X
Number of pages
4
Pages from-to
—
Publisher name
IEEE
Place of publication
Piscataway
Event location
Pilsen, Czech Republic
Event date
Sep 3, 2024
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001345150300023