Three ways to ceramic packages

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F17%3APU124339" target="_blank" >RIV/00216305:26220/17:PU124339 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919" target="_blank" >http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2017.8000919" target="_blank" >10.1109/ISSE.2017.8000919</a>

Result language
angličtina
Original language name
Three ways to ceramic packages
Original language description
This paper is focused on ceramic packaging primarily on the technology of creation. The first part is about ceramic packages and aluminium oxide in general. This paper shows three technologies of ceramic package creation. The first one is ceramic powder pressing. The second one is high temperature co-fired ceramic. The third one is ceramic mold casting. The paper describes issues of creation and shows inspection with a figure from scanning electron microscope. The last part is focused on thick film printing and finalization of the ceramic package.
Czech name
—
Czech description
—

Publication year
2017
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Electronics Technology (ISSE), 2017 40th International Spring Seminar on
ISBN
978-1-5386-0582-0
ISSN
2161-2536
e-ISSN
—
Number of pages
4
Pages from-to
249-254
Publisher name
IEEE Computer Society
Place of publication
Sofia, Bulgaria
Event location
Sofia
Event date
May 10, 2017
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000426973000042

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