The technology of ceramic packages
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F17%3APU124341" target="_blank" >RIV/00216305:26220/17:PU124341 - isvavai.cz</a>
Result on the web
<a href="http://eeict.feec.vutbr.cz/2017/sbornik/EEICT_2017-sbornik-komplet-2.pdf" target="_blank" >http://eeict.feec.vutbr.cz/2017/sbornik/EEICT_2017-sbornik-komplet-2.pdf</a>
DOI - Digital Object Identifier
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Alternative languages
Result language
čeština
Original language name
The technology of ceramic packages
Original language description
Abstract: This paper deals with the technology of ceramic packages. The first part is about ceramic in general. The next part is focused on used material Nabaltec and advantages of this type of technology i.e. ceramic powder pressing followed by the milling of the pressed ceramic and shows disadvantages of this technology step. The inspection was done by SEM pictures and shows the difference between sintered and unsintered ceramic. The last part is a simulation with 120mW power load and shows temperature distribution on the ceramic package compared with mold compound as the packaging material.
Czech name
The technology of ceramic packages
Czech description
Abstract: This paper deals with the technology of ceramic packages. The first part is about ceramic in general. The next part is focused on used material Nabaltec and advantages of this type of technology i.e. ceramic powder pressing followed by the milling of the pressed ceramic and shows disadvantages of this technology step. The inspection was done by SEM pictures and shows the difference between sintered and unsintered ceramic. The last part is a simulation with 120mW power load and shows temperature distribution on the ceramic package compared with mold compound as the packaging material.
Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2017
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the 21st Conference STUDENT EEICT 2017
ISBN
978-80-214-5496-5
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
542-546
Publisher name
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních
Place of publication
Brno
Event location
Brno
Event date
Apr 27, 2017
Type of event by nationality
CST - Celostátní akce
UT code for WoS article
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