Gas flow and heat transfer in reflow oven
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F18%3APU130278" target="_blank" >RIV/00216305:26220/18:PU130278 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919" target="_blank" >http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2018.8443763" target="_blank" >10.1109/ISSE.2018.8443763</a>
Alternative languages
Result language
angličtina
Original language name
Gas flow and heat transfer in reflow oven
Original language description
Soldering is very important technology to connect components and printed circuit boards together. Heat is transferred to soldering joint using flow of air or, generally, gas. Heat transfer is depending on more parameters, e.g. distance between product and nozzle field, strength of gas flow. It is very complex issue and not easy to measure. This paper describes some ideas, how to measure gas flow and heat transfer inside of an reflow oven.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2018
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2018 41st International Spring Seminar on Electronics Technology
ISBN
9781538657317
ISSN
2161-2536
e-ISSN
—
Number of pages
3
Pages from-to
254-256
Publisher name
IEEE Computer Society
Place of publication
Zlatibor, Serbia
Event location
Zlatibor
Event date
May 16, 2018
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000449866600084