Measurement of Gas Flow in Reflow Oven

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F19%3APU133140" target="_blank" >RIV/00216305:26220/19:PU133140 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919" target="_blank" >http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=8000919</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2019.8810150" target="_blank" >10.1109/ISSE.2019.8810150</a>

Result language
angličtina
Original language name
Measurement of Gas Flow in Reflow Oven
Original language description
Measuring of gas flow inside of an reflow furnace is very important issue, helping to optimize heat transfer and decrease power consumption of such machine. Nowadays we are using lead free solder alloys and optimized profiling is a must for high quality of soldering joints and as low as possible void rate. Mostly in medical and automotive branches are these technological methods very important. Our target is reliable production, it means reliable products. This is the basics for longer lifetime of electronics at all. Measuring equipment for 3D measuring of a gas flow is one of very important things to reach this target.
Czech name
—
Czech description
—

Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2019 42nd International Spring Seminar on Electronics Technology (ISSE)
ISBN
9781538657300
ISSN
2161-2536
e-ISSN
—
Number of pages
3
Pages from-to
151-154
Publisher name
IEEE Computer Society
Place of publication
Wroclaw, Poland
Event location
Wroclaw
Event date
May 15, 2019
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000507501000002

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