Photopolymer Quality Measurement for SLA 3D Printing Using EIS

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26220%2F24%3APU155057" target="_blank" >RIV/00216305:26220/24:PU155057 - isvavai.cz</a>

Result on the web

<a href="https://ieeexplore.ieee.org/document/10726288" target="_blank" >https://ieeexplore.ieee.org/document/10726288</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.23919/NTSP61680.2024.10726288" target="_blank" >10.23919/NTSP61680.2024.10726288</a>

Result language

angličtina

Original language name

Photopolymer Quality Measurement for SLA 3D Printing Using EIS

Original language description

Additive Manufacturing (AM), and particularly 3D printing, plays a pivotal role in various domains of prototype and functional part production. This paper concentrates on photopolymers as the foundational material utilized in 3D printing via StereoLithogrAphy (SLA). A prevalent issue within AM is ensuring the base material achieves the correct form and possesses the desired properties. Photopolymers, primarily composed of oligomers, monomers, and photoinitiators, can exhibit drastically altered properties of the resin and consequently, the final printed material depending on the quantity and type of constituents used. Furthermore, the base material is subject to aging, which detrimentally impacts its properties and may ultimately result in defective prints. By assessing the electrochemical properties of the base material through Electrochemical Impedance Spectroscopy (EIS), it is feasible to measure and appraise these alterations. The analysis of three samples at varying stages of degradation reveals that the evaporation of the photoinitiator within the resin leads to the deterioration of the photopolymer. This degradation increases the likelihood of print failure, poses a heightened risk of incomplete polymerization, and enhances the potential for material delamination. Given the non-destructive characteristic of the EIS technique and the observable variances in the data, EIS can be affirmed as an effective method for monitoring the quality of resin.

Czech name

—

Czech description

—

Type

D - Article in proceedings

CEP classification

—

OECD FORD branch

20201 - Electrical and electronic engineering

Project

<a href="/en/project/GA24-12982S" target="_blank" >GA24-12982S: Impedance spectroscopy of objects with fractional dynamics: New modeling approach</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year

2024

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

Proceedings of the International Conference on New Trends in Signal Processing, NTSP 2024

ISBN

978-80-8040-637-0

ISSN

—

e-ISSN

—

Number of pages

4

Pages from-to

60-63

Publisher name

IEEE

Place of publication

New York

Event location

Demanovska Dolina

Event date

Oct 16, 2024

Type of event by nationality

WRD - Celosvětová akce

UT code for WoS article

001359397200011