In-depth Analysis of 10 nm Exynos Processor using Micro CT and FIB-SEM System

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26620%2F19%3APU132842" target="_blank" >RIV/00216305:26620/19:PU132842 - isvavai.cz</a>
Result on the web
<a href="http://www.ipfa-ieee.org/" target="_blank" >http://www.ipfa-ieee.org/</a>
DOI - Digital Object Identifier
—

Result language
angličtina
Original language name
In-depth Analysis of 10 nm Exynos Processor using Micro CT and FIB-SEM System
Original language description
Latest technology nodes have made finer, more precise physical failure analysis techniques to emerge. Conventional techniques for larger technology nodes are slowly becoming ineffective. In this paper, we discuss effective yet non-invasive technique like micro CT where we get high fidelity images of the Exynos processor and complement it with further analysis using FIB-SEM systems-based preparation techniques like site-specific homogenous delayering, in-situ probing and TEM lamella preparation which enables failure analysis and reverse engineering techniques like nanoprobing and TEM imaging possible.
Czech name
—
Czech description
—

Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
ISBN
978-1-7281-3552-6
ISSN
—
e-ISSN
—
Number of pages
4
Pages from-to
1-4
Publisher name
Neuveden
Place of publication
neuveden
Event location
Hangzhou
Event date
Jun 2, 2019
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000541473300130

Similar results(10)