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Surface-Enhanced Raman Spectroscopy Investigation of DNA Molecules on Gold/Epoxy Nanocomposite Substrates

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216305%3A26620%2F20%3APU143760" target="_blank" >RIV/00216305:26620/20:PU143760 - isvavai.cz</a>

  • Alternative codes found

    RIV/00216305:26620/20:PU143945

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Surface-Enhanced Raman Spectroscopy Investigation of DNA Molecules on Gold/Epoxy Nanocomposite Substrates

  • Original language description

    Gold/epoxy nanocomposites were prepared by template-assisted solid-state dewetting and tested as a Surface-Enhanced Raman Scattering (SERS) substrates for DNA detection. The effect of excitation wavelength on the detected peak intensities was investigated with three different laser sources (532, 633, and 785 nm). The relationship between the plasmon absorbance band of the substrate and the excitation wavelength was studied. It was shown that the shift in the plasmon absorbance band, caused by the binding of the target-DNA molecules could have a major effect on the intensity of the measured peaks, which effect can be more significant than the signal contribution of target molecules on the surface.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

    <a href="/en/project/LM2018110" target="_blank" >LM2018110: CzechNanoLab research infrastructure</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Others

  • Publication year

    2020

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    2020 IEEE 26TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME 2020)

  • ISBN

    978-1-7281-7506-5

  • ISSN

  • e-ISSN

  • Number of pages

    5

  • Pages from-to

    32-36

  • Publisher name

    Neuveden

  • Place of publication

    neuveden

  • Event location

    Pitesti

  • Event date

    Oct 21, 2020

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000651085100004