All

What are you looking for?

All
Projects
Results
Organizations

Quick search

  • Projects supported by TA ČR
  • Excellent projects
  • Projects with the highest public support
  • Current projects

Smart search

  • That is how I find a specific +word
  • That is how I leave the -word out of the results
  • “That is how I can find the whole phrase”

Management of parasitic bipolars in modular high power LDMOS technology

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F26821532%3A_____%2F16%3AN0000008" target="_blank" >RIV/26821532:_____/16:N0000008 - isvavai.cz</a>

  • Result on the web

    <a href="http://ieeexplore.ieee.org/document/7599646/" target="_blank" >http://ieeexplore.ieee.org/document/7599646/</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/ESSDERC.2016.7599646" target="_blank" >10.1109/ESSDERC.2016.7599646</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Management of parasitic bipolars in modular high power LDMOS technology

  • Original language description

    M. Agam, J. Pjenčák, D. Prejda, A. Suwhanov, T. Yao and L. Šeliga, Management of parasitic bipolars in modular high power LDMOS technology, 46th European Solid-State Device Research Conference (ESSDERC), Lausanne, 2016, pp. 303-306. doi: 10.1109/ESSDERC.2016.7599646: Integration of isolated LDMOS transistors in smart power process is subjected to bipolar parasitics due to multi layers constructions that are needed for high voltage operation. These parasitics need to be minimized to assure proper circuit functionality. Several approaches for parasitics reduction are suggested: DTI (Deep Trench Isolation) module optimization, NLDMOS and PLDMOS device construction considerations, and lateral and vertical isolation techniques. Creating circuit level parasitic model which can be turned on and off is essential to verify circuit functionality of the improved isolation.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

    <a href="/en/project/TH01010419" target="_blank" >TH01010419: Development of Novel Technologies for Trench Insulated Gate Bipolar Transistors (TIGBT) Manufacturing</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Others

  • Publication year

    2016

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    2016 46th European Solid-State Device Research Conference (ESSDERC)

  • ISBN

    978-1-5090-2969-3

  • ISSN

    2378-6558

  • e-ISSN

  • Number of pages

    4

  • Pages from-to

    303-306

  • Publisher name

    IEEE

  • Place of publication

    Lausanne, Switzerland

  • Event location

    Lausanne, Switzerland

  • Event date

    Sep 12, 2016

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article