PCB Tests During Assembly and Splitting

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F47718684%3A_____%2F18%3AN0000034" target="_blank" >RIV/47718684:_____/18:N0000034 - isvavai.cz</a>
Result on the web
<a href="http://www.vzuplzen.cz" target="_blank" >http://www.vzuplzen.cz</a>
DOI - Digital Object Identifier
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Result language
angličtina
Original language name
PCB Tests During Assembly and Splitting
Original language description
The object of this presentation is the flexure inspection of printed circuit boards during assembly and operation. The goal is to identify high stresses which can lead to destruction especially of the soldered connections during final product operation using strain gauge technique. The strain gauge tests of printed circuit boards (PCB) represents complex work including FEA analysis, strain gauges installation and measurement and sometimes metallographic analysis of the cracked soldered joint, which often is the initiation for the own strain investigation. In. Proceedings of 18th International Conference on Experimental Mechanics ICEM 2018, Brussels (Belgium), USB Flash Disk (4 pages), June 2019. ISSN 2504-3900
Czech name
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Czech description
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Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2018
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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