Usage of inert atmosphere for solderability testing

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F12%3A43915621" target="_blank" >RIV/49777513:23220/12:43915621 - isvavai.cz</a>

Result on the web

—

DOI - Digital Object Identifier

—

Result language

angličtina

Original language name

Usage of inert atmosphere for solderability testing

Original language description

The article will present the results of the measured values from solderability testing of printed circuit boards. The aim of this paper is to compare different atmosphere for solderability testing with different finishes of printed circuit boards (PCB's). The article contains a description of the methods used for solderability testing of printed circuit boards. The method of wetting balance test was chosen for this experiment. The PCB can be made with several kinds of surface finishing. Copper is the most commonly used material in the manufacture of printed circuit boards. The negative property of copper is its low chemical stability. When a contact is in an atmosphere that contains oxygen, the surface is covered with a layer of copper oxides. This layer deteriorates copper solderability. Another way how to prevent oxidation of copper soldering pads of printed circuit boards is an inert atmosphere. As an inert atmosphere not contains oxygen prevents oxidation of the material used on PC

Czech name

—

Czech description

—

Type

O - Miscellaneous

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

—

Project

<a href="/en/project/ED2.1.00%2F03.0094" target="_blank" >ED2.1.00/03.0094: Regional Innovation Centre for Electrical Engineering (RICE)</a><br>

Continuities

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Publication year

2012

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů