High frequency behavior of microstrip lines on composite photopolymer substrates

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F07%3A43905980" target="_blank" >RIV/49777513:23220/07:43905980 - isvavai.cz</a>

Result on the web

<a href="http://dx.doi.org/10.1109/ISSE.2007.4432849" target="_blank" >http://dx.doi.org/10.1109/ISSE.2007.4432849</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1109/ISSE.2007.4432849" target="_blank" >10.1109/ISSE.2007.4432849</a>

Result language

angličtina

Original language name

High frequency behavior of microstrip lines on composite photopolymer substrates

Original language description

Recent trends in PCB design are microvia technologies. Several manufacturing processes are used for microvia technologies. PhotoVia is the method where the photoimageable dielectric materials have to be used. This paper deals with high frequency behaviorof microstrip lines created on special photodielectric substrates. Scattering parameters are possible to use to describe high frequency properties of microstrip lines. The results of scattering parameters measurement of microstrip lines on photodielectric substrates are compared with microstrip lines on FR-4 or ARLON ADxxxx substrates.

Czech name

—

Czech description

—

Type

D - Article in proceedings

CEP classification

JI - Composite materials

OECD FORD branch

—

Project

—

Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2007

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

ISSE 2007

ISBN

978-1-4244-1217-4

ISSN

—

e-ISSN

—

Number of pages

5

Pages from-to

208-212

Publisher name

Technical University

Place of publication

Cluj-Napoca

Event location

Cluj-Napoca, Rumunsko

Event date

May 9, 2007

Type of event by nationality

WRD - Celosvětová akce

UT code for WoS article

000255232500039