Optimization of PCB Design Assembly Using Yield Prediction

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F08%3A00500807" target="_blank" >RIV/49777513:23220/08:00500807 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Optimization of PCB Design Assembly Using Yield Prediction
Original language description
The paper deals with optimization of printed circuit board design using yield prediction. Yield prediction of PCB assembly process can be obtained from the below presented yield model. The model is based on a combination of elements from two most used yield prediction methodologies, namely: process yield and board design yield. Due to PCB assembly process yield prediction is possible not only to assist the manufacturers in determining reliable estimates of production capabilities, but also to optimize PCB design process. Through the use of sensitivity analysis can be determined the effect that each component package has on the manufacturing yield. The component packages having the biggest influence on the manufacturing yield loss represent potential failure areas. Due to this information is possible to optimize PCB design before the start of mass production in order to minimize or even to eliminate these problematic component packages.
Czech name
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Czech description
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Publication year
2008
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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