Optimization of Printed Circuit Board Design Assembly based on DPMO Metrics

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F10%3A00504884" target="_blank" >RIV/49777513:23220/10:00504884 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Optimization of Printed Circuit Board Design Assembly based on DPMO Metrics

Original language description

The paper deals with optimization of printed circuit board assembly (PCBA) design based on defects per million opportunities (DPMO) metric. Due to DPMO data predictions for a given new PCBA design is possible to optimize its layout in terms of yield andquality even before the PCBA pilot production. The DPMO data are obtained from the below presented yield-DPMO model. The model is based on a combination of elements from DPMO calculation according to the IPC 7912 standard and two most used yield prediction methodologies, namely: process yield and board design yield. The model provides not only DPMO data, but also assembly process yield prediction that can assist the manufacturers in determining reliable estimates of production capabilities.

Czech name

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Czech description

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Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

JS - Reliability and quality management, industrial testing

OECD FORD branch

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Project

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Continuities

S - Specificky vyzkum na vysokych skolach

Publication year

2010

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

ElectroScope

ISSN

1802-4564

e-ISSN

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Volume of the periodical

2010

Issue of the periodical within the volume

4

Country of publishing house

CZ - CZECH REPUBLIC

Number of pages

4

Pages from-to

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UT code for WoS article

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EID of the result in the Scopus database

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