Solderability Dependence on Surface Roughness

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F09%3A00501678" target="_blank" >RIV/49777513:23220/09:00501678 - isvavai.cz</a>
Result on the web
—
DOI - Digital Object Identifier
—

Result language
angličtina
Original language name
Solderability Dependence on Surface Roughness
Original language description
The article deals with results of solderability testing of printed circuit boards. The wetting balance test was used for solderability testing. This test makes wetting force measurement possible as a function of time. Measured values are recorded automatically. Surface roughness is one of parameters, which influence surface wetting. The article will present the results and comparison of tested printed circuit boards with different surface roughness. Differences were in levels of roughness and orientation of scratches. This comparison will be made for testing samples of printed circuit boards with surface pure copper (Cu). The test samples were purposely roughened by different abrasive paper before solderability testing. Roughness made on surface finishes was oriented vertically and horizontally. These orientations are relative to attachment tested sample in tester.
Czech name
—
Czech description
—

Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
EDS '09 IMAPS CS international conference proceedings
ISBN
978-80-214-3933-7
ISSN
—
e-ISSN
—
Number of pages
6
Pages from-to
—
Publisher name
Vysoké učení technické
Place of publication
Brno
Event location
Brno
Event date
Sep 3, 2009
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
—

Similar results(10)