Detection of Printed Circuit Board Failures Based on Signal Frequency Analyses

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F11%3A43896476" target="_blank" >RIV/49777513:23220/11:43896476 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1109/ISSE.2011.6053571" target="_blank" >http://dx.doi.org/10.1109/ISSE.2011.6053571</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2011.6053571" target="_blank" >10.1109/ISSE.2011.6053571</a>

Result language
angličtina
Original language name
Detection of Printed Circuit Board Failures Based on Signal Frequency Analyses
Original language description
The inspections of printed circuit boards are necessary carry out because of failures and defects detection. Cracks and change of conductive path width are included to the most frequently defects on printed circuits board where are difficulty detected. These defects can cause change of transmission signal integrity thereby it is necessary their detection. New method for detection of these defects was designed. This method is based on measurement of scattering parameters or spectrum of transmission signal. By evaluation of measurement values the failures and defects can be detected. The results obtained by scattering parameters measuring on conductive path with cracks are presented.
Czech name
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Czech description
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Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
34th Internatiobal Spring Seminar on Electronics Technology
ISBN
978-1-4577-2112-0
ISSN
2161-2528
e-ISSN
—
Number of pages
4
Pages from-to
1-4
Publisher name
Technická univerzita v Košiciach
Place of publication
Bratislava
Event location
Slovensko - Tatranská Lomnica
Event date
May 11, 2011
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
—

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