Formation and Growth of Intermetallic Compounds in Solder Joint
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F11%3A43899176" target="_blank" >RIV/49777513:23220/11:43899176 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
čeština
Original language name
Formování a růst intermetalických sloučenin v pájeném spoji
Original language description
This article deals with intermetallic layers which occure at the interface between solder and soldered material. Formation and growth observing of intermetallic compounds (IMC) between various lead-free soldering alloys and basic material is subject of wide interest. Because new lead-free solder alloys are increasingly being developed and marketed.
Czech name
Formování a růst intermetalických sloučenin v pájeném spoji
Czech description
This article deals with intermetallic layers which occure at the interface between solder and soldered material. Formation and growth observing of intermetallic compounds (IMC) between various lead-free soldering alloys and basic material is subject of wide interest. Because new lead-free solder alloys are increasingly being developed and marketed.
Classification
Type
O - Miscellaneous
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů