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Formation and Growth of Intermetallic Compounds in Solder Joint

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F11%3A43899176" target="_blank" >RIV/49777513:23220/11:43899176 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    čeština

  • Original language name

    Formování a růst intermetalických sloučenin v pájeném spoji

  • Original language description

    This article deals with intermetallic layers which occure at the interface between solder and soldered material. Formation and growth observing of intermetallic compounds (IMC) between various lead-free soldering alloys and basic material is subject of wide interest. Because new lead-free solder alloys are increasingly being developed and marketed.

  • Czech name

    Formování a růst intermetalických sloučenin v pájeném spoji

  • Czech description

    This article deals with intermetallic layers which occure at the interface between solder and soldered material. Formation and growth observing of intermetallic compounds (IMC) between various lead-free soldering alloys and basic material is subject of wide interest. Because new lead-free solder alloys are increasingly being developed and marketed.

Classification

  • Type

    O - Miscellaneous

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2011

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů